Antenna-in-Package Technology and Applications. Duixian Liu

Antenna-in-Package Technology and Applications

of the (a) H‐ and (b) E‐plane...Figure 7.33 (a) 3D view of the dome lens antenna (left). HFSS model (right) of...Figure 7.34 Full antenna system radiation patterns at f = 140 GHz. Comparison ...Figure 7.35 Complete antenna system with active chip and PC board for 5G backh...Figure 7.36 Transceiver power consumption breakdown, TRX end‐to‐end measuremen...Figure 7.37 Chosen HDI technology buildup for 240 GHz AiP (from [19]).Figure 7.38 3D view of the HFSS model of the 240‐GHz BGA source (from [19]).Figure 7.39 Simulated and measured broadside realized copolarization gain and ...Figure 7.40 Post‐simulated and measured copolarization broadside realized gain...

8 Chapter 8Figure 8.1 Development of the eWLB since its introduction in 2006.Figure 8.2 Outline of a classical WLP with a fan‐in area (left) and an eWLB pa...Figure 8.3 Process flow for the fabrication of the eWLB package. The process f...Figure 8.4 Cross‐section of a typical eWLB package with fan‐in and fan‐out are...Figure 8.5 Cross‐section of vertical interconnections realized in the eWLB usi...Figure 8.6 (a) Photograph of a system carrier with Si dies and EZL interconnec...Figure 8.7 A flexible EZL enables the realization of single vertical interconn...Figure 8.8 Transmission lines available in the eWLB.Figure 8.9 (a) Photograph and (b) measured (solid line) and simulated (dotted ...Figure 8.10 (a) Photograph and (b) measured (solid line) and simulated (dotted...Figure 8.11 Measured (solid line) and simulated (dotted line) contributions of...Figure 8.12 (a) Photograph of a single‐layer spiralinductor in the eWLB with N...Figure 8.13 (a) Photograph and (b) measured (solid line) and simulated (dotted...Figure 8.14 Photographs of (a) a parallel LC resonant circuit and (b) a 2.45‐G...Figure 8.15 Photographs of (a) a 60‐GHz branch‐line coupler and (b) a 60‐GHz r...Figure 8.16 (a) Design and (b) simulated

‐parameters of a 60‐GHz rat‐race cou...Figure 8.17 Photograph of a four‐channel 77‐GHz radar receiver in the eWLB (fr...Figure 8.18 Simulated

‐parameters of an optimized differential chip–package–b...Figure 8.19 (a) CT image and photograph and (b) measured

‐parameters of a cas...Figure 8.20 (a) 3D model and (b) simulated

‐parameters of a differential vert...Figure 8.21 (a) Simulated insertion loss

and maximal available gain

and (b...Figure 8.22 Integration of the antenna in the eWLB (from [17], ©2019 IEEE, rep...Figure 8.23 Photographs of typical antennas manufactured in the RDL of the eWL...Figure 8.24 Vertical dipole antenna using an EZL (from [6], ©2019 IEEE, reprin...Figure 8.25 Antenna realized on the package top surface using an EZL for verti...Figure 8.26 (a) CT image and photograph of an EZL‐based vertical dipole antenn...Figure 8.27 Photographs of (a) the bistatic and (b) the monostatic transceiver...Figure 8.28 Differential parallel feed system for two antenna elements for a 6...Figure 8.29 Photographs of the eWLB package for a 60‐GHz monostatic transceive...Figure 8.30 Simulated (dotted line) and measured (solid line) (a) return loss ...Figure 8.31 Photographs of the eWLB package for a 60‐GHz bistatic transceiver ...Figure 8.32 Simulated (dotted line) and measured (solid line) (a) return loss ...Figure 8.33 Photograph of a 77‐GHz eWLB module with four dipole antennas integ...Figure 8.34 Photograph of the front‐end consisting of a four‐channel transceiv...Figure 8.35 Simulated and measured gain of the antenna array for (a) active TX...Figure 8.36 Resulting power distribution using a target of approximately 10 m

Figure 8.37 Photograph of a 60‐GHz eWLB module with two dipole and four patch ...Figure 8.38 EM simulation environment (from [23], ©2019 IEEE, reprinted with p...Figure 8.39 (a) Electric field distribution in the E‐ and H‐planes at 60 GHz a...Figure 8.40 (a) Electric field distribution in the E‐ and H‐planes at 60 GHz a...Figure 8.41 Simulated (a) receiver and (b) transmitter antenna return loss (fr...Figure 8.42 Simulated isolation between transmitter and receiver channels (fro...

9 Chapter 9Figure 9.1 Comparisons between subtractive and additive manufacturing processe...Figure 9.2 The FormLabs SLA printer has seen widespread adoption due to a low ...Figure 9.3 Photograph of a commercially available split post dielectric resona...Figure 9.4 Material characterization using waveguides.Figure 9.5 Inkjet printed on‐package mmWave bow‐tie antenna samples [9].Figure 9.6 “Smart” wireless encapsulation process flow. (a) 3D print partial e...Figure 9.7 (a) Fully‐printed 3D TMV‐integrated partial encapsulation with sili...Figure 9.8 (a) The effects of exposure time on the 3D printed substrate. (b) D...Figure 9.9 Flexibility of the 3D printed substrate (from [12], © 2018 IEEE, re...Figure 9.10 Ink adhesion on the 3D printed substrate (a) without surface treat...Figure 9.11 (a) Inkjet printing of a silver trace without an SU‐8 layer and (b...Figure 9.12 3D and inkjet printing fabrication process (from [12], © 2018 IEEE...Figure 9.13 (a) The proposed broadband on‐package antenna. (b) The inkjet and ...Figure 9.14 (a) Measured and simulated

. (b) Measured gain of the proposed Ai...Figure 9.15 Measured radiation pattern of the proposed broadband on‐package an...Figure 9.16 (a) SoP design using 3D inter‐layer connections. (b) Proof‐of‐conc...Figure 9.17 SoP design (a) with IC attached and (b) sealed with flexible mater...Figure 9.18 Miniaturized 3D and inkjet printed SoP design (from [12], © 2018 I...Figure 9.19 AM SoP module design.

10 Chapter 10Figure 10.1 A 3‐2‐3 SLC cross‐section.Figure 10.2 A typical AiP‐based phased array stack‐up.Figure 10.3 The stack‐up of the proposed AiP structure.Figure 10.4 Waves related to a patch antenna.Figure 10.5 The vertical transition: (a) 2D view, (b) cross‐section, and (c) 3...Figure 10.6 Simulated reflection coefficient (S11) of the transitions.Figure 10.7 Simulated S12 of the transitions.Figure 10.8 The aperture‐coupled stacked patch antenna structure: (a) antenna ...Figure 10.9 A sketch of the complete vertical feed line sections.Figure 10.10 Photograph of the fabricated prototype antenna vehicle.Figure 10.11 Measured and simulated results of the antenna element: (a) reflec...Figure 10.12 Measured and simulated E‐plane radiation patterns: (a) horizontal...Figure 10.13 An illustration of AiP assembly breakout: (a) layer stack‐up and ...Figure 10.14 An illustration of antenna feed line routing.Figure 10.15 Top view (a) and bottom view (b) of a fully assembled antenna arr...Figure 10.16 (a) Antenna testing chamber and setup for passive antenna element...Figure 10.17 Direct soldered module on a PCB with external IF and LO signals (...Figure 10.18 Measured and simulated 64‐element H‐polarization beams at boresig...Figure 10.19 Measured 64‐element H‐polarization beam patterns steering to

af...Figure 10.20 (a) Measured beam steering example at a fixed variable gain ampli...Figure 10.21 (a) Illustration of two different types of mmWave backhaul link, ...Figure 10.22 Scalable phased‐array concept (from [11], © 2015 IEEE, reprinted ...Figure 10.23 Antenna and package options for W‐band scalable phased array (fro...Figure 10.24 A nonuniform linear array with

isotropic radiators.Figure 10.25 Array simulation for a nonuniform linear array with 48 isotropic ...Figure 10.26 (a) Illustration of a W‐band phased‐array MCM module and (b) a pa...Figure 10.27 (a) Prototype antenna design and (b) the actual layout of the ant...Figure 10.28 Measured and simulated antenna reflection coefficients (from [30]...Figure 10.29 Measured and simulated radiation patterns of the phi and theta co...Figure 10.30 A close‐up view of the four‐chip package with actual patch antenn...Figure 10.31 Simulated antenna array with 1024 isotropic radiators based on th...Figure 10.32 Simulated 1024‐element radiation patterns with beams at ...Figure 10.33 A large‐scale 128‐port 3D full‐wave HFSS model for the package si...Figure 10.34 Simulated reflection coefficients (both polarizations) of the 16 ...Figure 10.35 Phased‐array package layout housing four SiGe ICs with 64 dual‐po...Figure 10.36 Flip‐chip assembled packages with 64 integrated antennas (package...Figure 10.37 A socket with high‐speed pogo pins for package screening and test...Figure 10.38 An assembled package mounted to the test board for antenna radiat...Figure 10.39 W‐band antenna chamber measurement setup (from [31], © 2014 IEEE,...Figure

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