Design for Excellence in Electronics Manufacturing. Cheryl Tulkoff
vibration
Bending
Integrated circuit/semiconductor wear‐out
Thermal derating
Failure rate analysis
Conductive anodic filament (CAF) qualification
High‐fidelity PCB modeling
Sherlock provides actionable recommendations and presents results in comprehensive, professional reports suitable for internal and external distribution.
2.7 Summary
Establishing a comprehensive reliability program requires extensive planning, training, and expertise. Once established, however, an effective program reduces risk, costs, and failures and results in products that function reliably and satisfy customers. The simple truth is that designing in reliability up front pays off immensely over the life of the product. A reliability program ensures that this happens.
As can be seen, each type of test plan has unique properties and approaches.
References
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2 Allen, G. and Jarman, R. (1999). Collaborative R and D. New York: Wiley and Sons.
3 Ireson, W. and Coombs, C. (1989). Handbook of Reliability Engineering and Management. New York: McGraw Hill.
4 Morgan, L. (2015). 7 common biases that skew big data results. Information Week.
5 Nuzzo, R. (2015). How scientists fool themselves ‐ and how they can stop. Nature 526: 182‐185. doi: 10.1038/526182a.
6 O'Connor, P. (2012). Practical Reliability Engineering. New York: Wiley and Sons.
7 Porta, M. (2014). A dictionary of epidemiology. Oxford University Press.
8 Tinsley, C.H., Dillon, R.L., and Madsen, P.M. (2011). How to avoid catastrophe. Harvard Business Review. https://hbr.org/2011/04/how-to-avoid-catastrophe.
9 Tulkoff, C. (2017). How reliable is your reliability data? Global SMT and Packaging Magazine.
10 Wunderle, B. and Michel, B. (2006). Progress in reliability research in the micro and nano region. Microelectronics and Reliability 46 (9): 11.
11 Wunderle, B. and Michel, B. (2007). Printed circuit board design integrity: The key to successful PCB development. http://new.marketwire.com/2.0/rel.jsp?id=730231.
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