Artificial Intelligence Hardware Design. Albert Chun-Chen Liu
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Artificial Intelligence Hardware Design
Challenges and Solutions
Albert Chun Chen Liu and Oscar Ming Kin Law
Kneron Inc.,San Diego, CA, USA
Copyright © 2021 by The Institute of Electrical and Electronics Engineers, Inc. All rights reserved.
Published by John Wiley & Sons, Inc., Hoboken, New Jersey.
Published simultaneously in Canada.
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ISBN: 9781119810452
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Author Biographies
Albert Chun Chen Liu is Kneron’s founder and CEO. He is Adjunct Associate Professor at National Tsing Hua University, National Chiao Tung University, and National Cheng Kung University. After graduating from the Taiwan National Cheng Kung University, he got scholarships from Raytheon and the University of California to join the UC Berkeley/UCLA/UCSD research programs and then earned his Ph.D. in Electrical Engineering from the University of California Los Angeles (UCLA). Before establishing Kneron in San Diego in 2015, he worked in R&D and management positions in Qualcomm, Samsung Electronics R&D Center, MStar, and Wireless Information.
Albert has been invited to give lectures on computer vision technology and artificial intelligence at the University of California and be a technical reviewer for many internationally renowned academic journals. Also, Albert owned more than 30 international patents in artificial intelligence, computer vision, and image processing. He has published more than 70 papers. He is a recipient of the IBM Problem Solving Award based on the use of the EIP tool suite in 2007 and IEEE TCAS Darlington award in 2021.
Oscar Ming Kin Law developed his interest in smart robot development in 2014. He has successfully integrated deep learning with the self‐driving car, smart drone, and robotic arm. He is currently working on humanoid development. He received a Ph.D. in Electrical and Computer Engineering from the University of Toronto, Canada.
Oscar currently works at Kneron for in‐memory computing and smart robot development. He has worked at ATI Technologies, AMD, TSMC, and Qualcomm and led various groups for chip verification, standard cell design, signal integrity, power analysis, and Design for Manufacturability (DFM). He has conducted different seminars at the University of California, San Diego, University of Toronto, Qualcomm, and TSMC. He has also published over 60 patents in various areas.