Design for Excellence in Electronics Manufacturing. Cheryl Tulkoff

Design for Excellence in Electronics Manufacturing - Cheryl Tulkoff


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      Table of Contents

      1  Cover

      2  Series Title Wiley Series in Quality & Reliability Engineering Wiley Series in Quality & Reliability Engineering

      3  Title Page

      4  Copyright

      5  Dedication

      6  Contributors

      7  List of Figures

      8  List of Tables

      9  Series Editor's Foreword by Dr. Andre Kleyner

      10  Foreword

      11  Preface

      12  Acknowledgments

      13  Acronyms

      14  1 Introduction to Design for Excellence 1.1 Design for Excellence (DfX) in Electronics Manufacturing 1.2 Chapter 2: Establishing a Reliability Program 1.3 Chapter 3: Design for Reliability (DfR) 1.4 Chapter 4: Design for the Use Environment: Reliability Testing and Test Plan Development 1.5 Chapter 5: Design for Manufacturability (DfM) 1.6 Chapter 6: Design for Sustainability 1.7 Chapter 7: Root Cause Problem‐Solving, Failure Analysis, and Continual Improvement Techniques

      15  2 Establishing a Reliability Program 2.1 Introduction 2.2 Best Practices and the Economics of a Reliability Program 2.3 Elements of a Reliability Program 2.4 Reliability Data 2.5 Analyzing Reliability Data: Commonly Used Probability and Statistics Concepts in Reliability 2.6 Reliability Analysis and Prediction Methods 2.7 Summary References

      16  3 Design for Reliability 3.1 Introduction 3.2 DfR and Physics of Failure 3.3 Specifications (Product and Environment Definitions and Concerns) 3.4 Reliability Physics Analysis 3.5 Surviving the Heat Wave 3.6 Redundancy 3.7 Plating Materials: Tin Whiskers 3.8 Derating and Uprating 3.9 Reliability of New Packaging Technologies 3.10 Printed Circuit Boards 3.11 Non‐Functional Pads 3.12 Wearout Mechanisms 3.13 Conformal Coating and Potting References

      17  4 Design for the Use Environment: Reliability Testing and Test Plan Development 4.1 Introduction 4.2 Standards and Measurements 4.3 Failure‐Inducing Stressors 4.4 Common Test Types 4.5 Test Plan Development References

      18  5 Design for Manufacturability 5.1 Introduction 5.2 Overview of Industry Standard Organizations 5.3 Overview of DfM Processes 5.4 Component Topics 5.5 Printed Circuit Board Topics 5.6 Process Materials 5.7 Summary: Implementing DfM References

      19  6 Design for Sustainability 6.1 Introduction 6.2 Obsolescence Management 6.3 Long‐Term Storage 6.4 Long‐Term Reliability Issues 6.5 Counterfeit Prevention and Detection Strategies 6.6 Supplier Selection References

      20 


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