Design for Excellence in Electronics Manufacturing. Cheryl Tulkoff
3.37 E‐Field and dendritic growth.Figure 3.38 Non‐functional pads example.Figure 3.39 Typical bathtub curve.Figure 3.40 Conformal coating Tg behavior.
3 Chapter 4Figure 4.1 Changes to the typical bathtub curve.Figure 4.2 MLCC life expectancy.Figure 4.3 Temperature variation in a trucking container.Figure 4.4 Failure load conditions.Figure 4.5 Power cycling.Figure 4.6 Manufacturing operations impacting bending.Figure 4.7 Cracked capacitor and pad cratering.Figure 4.8 Strain gauge.Figure 4.9 Vibration durability issue 1.Figure 4.10 Vibration durability issue 2.Figure 4.11 Preconditioning Weibull slope change.Figure 4.12 Acceleration factor calculations.Figure 4.13 Potential failure modes and tests.
4 Chapter 5Figure 5.1 Cost increases associated with DfM implementation.Figure 5.2 IPC Standards 2019.Figure 5.3 Thermal stress crack.Figure 5.4 Visible thermal stress crack..Figure 5.5 Vertical crack under termination..Figure 5.6 Mechanical shock failure modes..Figure 5.7 ICT fixture.Figure 5.8 Resistor damaged by sulfur dioxide..Figure 5.9 IC wearout concern.Figure 5.10 Surface finishes.Figure 5.11 Black pad images.Figure 5.12 Silver creep..Figure 5.13 PTH failure..Figure 5.14 CAF examples..Figure 5.15 QFN bondline.Figure 5.16 QFN I/O pad and thin bondline.Figure 5.17 Windowpane stencil structure.Figure 5.18 Solder paste volume change..Figure 5.19 CTE and modulus change.Figure 5.20 Cleaning process considerations.
5 Chapter 6Figure 6.1 Kirkendall or champagne voids.Figure 6.2 Counterfeit definitions.Figure 6.3 Basic validation process flow.Figure 6.4 Plating voids.Figure 6.5 Glass fiber protrusion.Figure 6.6 Plating folds.Figure 6.7 Plating nodules.Figure 6.8 Etch pits.
6 Chapter 7Figure 7.1 Problem‐solving vs. root cause problem‐solving.Figure 7.2 The eight disciplines process.Figure 7.3 Scanning acoustic microscopy system.Figure 7.4 Through transmission acoustic microscopy.Figure 7.5 Peak amplitude acoustic microscopy.Figure 7.6 Phase inversion acoustic microscopy.Figure 7.7 X‐ray microscopy.Figure 7.8 Thermal imaging.Figure 7.9 Superconducting quantum interfering device microscopy.Figure 7.10 Decapsulation system.Figure 7.11 Cross‐section polishing.Figure 7.12 Cross‐section of a BGA.Figure 7.13 Scanning electron microscope system.Figure 7.14 SEM EDX spectra.Figure 7.15 Xyztec combination wire bond and shear tester.Figure 7.16 Fourier transform system.Figure 7.17 Ion chromatography system.Figure 7.18 Digital image correlation setup.Figure 7.19 Plan‐do‐check‐act process.
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Series Title
Wiley Series in Quality & Reliability Engineering
Dr. Andre Kleyner
Series Editor
The Wiley Series in Quality & Reliability Engineering aims to provide a solid educational foundation for both practitioners and researchers in the Q&R field and to expand the reader's knowledge base to include the latest developments in this field. The series will provide a lasting and positive contribution to the teaching and practice of engineering.
The series coverage will contain, but is not exclusive to,
Statistical methods
Physics of failure
Reliability modeling
Functional safety
Six‐sigma methods
Lead‐free electronics
Warranty analysis/management
Risk and safety analysis
Wiley Series in Quality & Reliability Engineering
Design for Excellence in Electronics Manufacturing
Cheryl Tulkoff, Greg Caswell
April 2021
Reliability Culture: How Leaders can Create Organizations that Create Reliable Products
Adam P. Bahret
February 2021
Design for Maintainability
Louis J. Gullo, Jack Dixon
February 2021
Lead‐free Soldering Process Development and Reliability
Jasbir Bath (Editor)
September 2020
Automotive System Safety: Critical Considerations for Engineering and Effective Management
Joseph D. Miller
February 2020
Prognostics and Health Management: A Practical Approach to Improving System Reliability