Antenna-in-Package Technology and Applications. Duixian Liu
(AR), and gesture radars at 60 GHz, automotive radars at 79 GHz, imagers at 94 GHz, sensors at 122, 145, and 160 GHz, as well as 300‐GHz wireless links. The advantages of AiP technology will continue to generate new applications, for example the adoption of AiP technology in the development of highly integrated micro‐synthetic aperture radar (SAR) for deep‐space exploration [46].
1.5 Concluding Remarks
AiP technology has broken the boundaries between antenna and circuit fields. The methodology and platform to co‐design antenna and circuits is now available. AiP technology has justified developing new materials and processes, which is rare, to the best of my knowledge, and only microstrip patch antennas have received such attention. Testing has to be considered along the whole manufacturing cycle, including test strategies, verification and characterization, production testing, integration and system level testing. Probe‐based measurement setups are suitable for AiP design verification and characterization. OTA antenna measurements are required for production testing, integration and system level testing. In the future, AiP technology will continue to provide direct antenna solutions to highly integrated wireless systems that will operate at even higher mmWave frequencies. It will also provide parasitic or distributive radiator functions to enhance the terahertz antenna performance of AoC technology.
Acknowledgements
The author is grateful to his students Dr. Wang Junjun, Dr. Sun Mei, Dr. Zhang Bing, Dr. Chen Zihao, Mr. Lin Wei, and Mr. Xue Yang, his research staff Dr. Zhang Wenmei, Dr. Sang‐Hyuk Wi, Dr. Tu Zhihong, and Ms. Zhang Lin, and his collaborators Dr. Duixian Liu and Mr. Brian P. Gaucher of the IBM Thomas J. Watson Research Center and Dr Albert Lu, Mr. Chua Kai Meng, and Ms. Wai Lai Lai of the Singapore Institute of Manufacturing Technology for their contribution in the development of AiP technology.
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