|
ASIC
|
application‐specific integrated circuit
|
|
ASUT
|
antenna system under test
|
|
AUT
|
antenna under test
|
|
Az
|
azimuth
|
|
BCB
|
benzocyclobutene
|
|
BC‐SRR
|
broadside‐coupled SRR
|
|
BER
|
bit error rate
|
|
BERT
|
BER tester
|
|
BiCMOS
|
bipolar complementary metal oxide semiconductor
|
|
BGA
|
ball grid array
|
|
BLE
|
Bluetooth low energy
|
|
BT
|
Bluetooth
|
|
BT
|
bismaleimide triazine
|
|
BW
|
bandwidth
|
|
C4
|
controlled collapse chip connection
|
|
CATR
|
compact antenna test range
|
|
CCL
|
copper‐clad laminate
|
|
CLIP
|
continuous liquid interface printing
|
|
CMA
|
characteristic mode analysis
|
|
CMF
|
conjugate match factor
|
|
CMG
|
conjugate match gain
|
|
CMOS
|
complementary metal‐oxide semiconductor
|
|
CNC
|
computer numerical controlled
|
|
CP
|
circular polarization
|
|
CPS
|
coplanar strip
|
|
CPU
|
central processing unit
|
|
CPW
|
coplanar waveguide
|
|
CT
|
computer tomography
|
|
CTE
|
coefficient of thermal expansion
|
|
CUF
|
capillary underfill
|
|
DC
|
direct current
|
|
DLP
|
digital light projection
|
|
DMA
|
dynamic mechanical analysis
|
|
DRAM
|
dynamic random‐access memory
|
|
DRIE
|
deep reactive ion etching
|
|
EBG
|
electromagnetic bandgap
|
|
EIRP
|
equivalent isotropic radiated power
|
|
El
|
elevation
|
|
EM
|
electromagnetic
|
|
EMI
|
electromagnetic interference
|
|
ESD
|
electrostatic discharge
|
|
ETS
|
embedded traces
|
|
eWLB
|
embedded wafer‐level ball grid array
|
|
EZL
|
embedded Z line
|
|
FCC
|
Federal Communications Commission
|
|
FDM
|
fused‐deposition modeling
|
|
FE
|
front end
|
|
FF
|
far‐field
|
|
FMCW
|
frequency modulated continuous wave
|
|
FoM
|
figure of merit
|
|
FO PoP
|
fan‐out package‐on‐package
|
|
FO‐WLP
|
fan‐out wafer‐level packaging
|
|
FPGA
|
field‐programmable gate array
|
|
FR4
|
flame resistant 4
|
|
FSS
|
frequency selective surface
|
|
GaAs
|
gallium arsenide
|
|
GaN
|
gallium nitride
|
|
Gb/s
|
gigabit per second
|
|
GPU
|
graphics processing unit
|
|
GSG
|
ground‐signal‐ground
|
|
GSGSG
|
ground‐signal‐ground‐signal‐ground
|
|
GSM
|
global system for mobile communications
|
|
HAST
|
highly accelerated stress test
|
|
HBM
|
high bandwidth memory
|
|
HDI
|
high‐density integration
|
|
HDI
|
high‐density interconnect
|
|
HFSS
|
high‐frequency structure simulator
|
|
HPBW
|
half‐power beam width
|
|
HTCC
|
high‐temperature co‐fired ceramics
|
