Antenna-in-Package Technology and Applications. Duixian Liu
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ISBN: 9781119556633
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List of Contributors
Yueping Zhang
School of Electrical and Electronic Engineering
Nanyang Technological University
Singapore
Ning Ye
Package Technology Development & Integration
Milpitas
USA
Xiaoxiong Gu
Thomas. J. Watson Research Center, IBM
New York
USA
Pritish Parida
Thomas. J. Watson Research Center, IBM
New York
USA
A.C.F. Reniers
Department of Electrical Engineering
Eindhoven University of Technology (TU/e)
Eindhoven
The Netherlands
U. Johannsen
Department of Electrical Engineering
Eindhoven University of Technology (TU/e)
Eindhoven
The Netherlands
A.B. Smolders
Department of Electrical Engineering
Eindhoven University of Technology (TU/e)
Eindhoven
The Netherlands
Atif Shamim
Computer, Electrical and Mathematical Sciences and Engineering Division
King Abdullah University of Science & Technology (KAUST)
KSA
Haoran Zhang
Computer, Electrical and Mathematical Sciences and Engineering Division
King Abdullah University of Science & Technology (KAUST)
KSA
Frédéric Gianesello
ST Microelectronics
Technology R&D
Silicon Technology Development
Crolles
France
Diane Titz
Université Nice Sophia Antipolis
Polytech'Lab
Biot
France
Cyril Luxey
Université Nice Sophia Antipolis
Polytech'Lab
Biot
France
Maciej Wojnowski
Infineon Technologies AG
Neubiberg
Germany
Klaus Pressel
Infineon Technologies AG
Regensburg
Germany
Tong‐Hong Lin
The School of Electrical and Computer Engineering
Georgia Institute of Technology
Atlanta
USA
Ryan A. Bahr
The School of Electrical and Computer Engineering
Georgia Institute of Technology
Atlanta
USA
Manos M. Tentzeris
The School of Electrical and Computer Engineering
Georgia Institute of Technology
Atlanta
USA
Duixian Liu
Thomas. J. Watson Research Center, IBM
New York
USA
Amin Enayati
Emerson & Cuming Anechoic Chambers
Antwerp Area
Belgium
Karin Mohammadpour‐Aghdam
School of Electrical and Computer Engineering
University of Tehran
Iran
Farbod Molaee‐Ghaleh
School of Electrical and Computer Engineering
University of Tehran
Iran
Preface
Rapid advances in semiconductor and packaging technologies have promoted the development of two system design concepts known as system on chip (SoC) and system‐in‐package (SiP). SoC integrates analog, digital, mixed‐signal, and radio frequency (RF) circuits on a chip by a semiconductor process, while SiP implements separately manufactured functional blocks in a package by a packaging process. SoC yields improved system reliability and functionality at a much lower system cost. However, it degrades system performance and increase system power consumption due to unavoidable compromises in every circuit type in order to use the same material and process. On the contrary, SiP enhances system performance and reduces system power consumption but results in lower system reliability and higher system cost because of functional blocks and the fabrication of the package with different materials and processes.
Antennas are essential components